Lead-free solder paste RSN 70 LF Di SIA

RSN 70 LF Di SIA lead-free no-clean solder paste is suitable for all types of dispensers, the dispensing needle must be adapted to the grain size of the solder paste. Thanks to its low melting temperature of 189 degrees Celsius, it is a full replacement for lead solder paste with all its advantages. Remelting is possible by conventional furnace as well as by vapor brazing, hot plate, laser brazing, hot air brazing, etc. It is an alloy of tin, bismuth and a small ratio of additives.
The paste is supplied in a 10 cc cartridge, but other packages are also possible. Please contact us for a quote on other packaging.