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Lead-free solder paste BLF04 Sn96,5Ag3Cu0,5
SC-BLF04
Solder Chemistry
Product features
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Unleaded
Sn96.5Ag3Cu0.5
0.5 kg
The crucible
BLF04 is a lead-free solder paste designed for screen printing applications in T4 class.
The paste is supplied in a 0.5 kg cup.
SOLDER CHEMISTRY SC BLF04 solder paste is a high-tech product
suitable for all SMT applications.
SC BLF04 is a homogeneous blend of solder powder, in all required alloys and grain sizes, with an organic flux based on synthetic rosin, conforming to RE L0
according to J-STD-004 or RMA. It is therefore one of the most advanced "no-clean"
solder pastes.
SC-BLF04 solder paste is characterized by excellent crash resistance, long processing time of hours, no bead formation, high tack and high temperature stability.
The paste is supplied in a 0.5 kg cup.
SOLDER CHEMISTRY SC BLF04 solder paste is a high-tech product
suitable for all SMT applications.
SC BLF04 is a homogeneous blend of solder powder, in all required alloys and grain sizes, with an organic flux based on synthetic rosin, conforming to RE L0
according to J-STD-004 or RMA. It is therefore one of the most advanced "no-clean"
solder pastes.
SC-BLF04 solder paste is characterized by excellent crash resistance, long processing time of hours, no bead formation, high tack and high temperature stability.
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