SC-BLF03 - Bezolovnatá pájecí pasta Sn96,5Ag3,5
SC-BLF03 - Bezolovnatá pájecí pasta Sn96,5Ag3,5

Lead-free solder paste BLF03 Sn96,5Ag3,5

SC-BLF03
Solder Chemistry
780.00 CZK
Tax excluded
943.80 CZK Tax included

Product features
Type of material:
Mail
Type of solder:
Unleaded
Alloy composition:
Sn96.5Ag3.5
Package weight:
0.035 kg
Type of packaging:
Cartridge
 
BLF03 is a lead-free solder paste designed for dispensing by manual or automatic dispenser.

The paste is supplied in a 10cc/35g cartridge.

SOLDER CHEMISTRY SC BLF03 solder paste is a high-tech product
suitable for all SMT applications.
SC BLF03 is a homogeneous blend of solder powder, in all required alloys and grain sizes, with an organic flux based on synthetic rosin, conforming to RE L0
according to J-STD-004 (exceeds RMA requirements). It is therefore one of the most advanced "no-clean"
solder pastes.

SC-BLF03 solder paste is characterized by excellent resistance to slumping, does not form beads, has high adhesiveness and high temperature stability.
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