SC-BLF03 - Bezolovnatá pájecí pasta Sn96,5Ag3,5

Lead-free solder paste BLF03 Sn96,5Ag3,5

Reference: SC-BLF03

Brand: Solder Chemistry

delivery 25-30 days

780.00 CZK

Tax excluded

943.80 CZK Tax included

Type of material:

Mail

Type of solder:

Unleaded

Alloy composition:

Sn96.5Ag3.5

Package weight:

0.035 kg

Type of packaging:

Cartridge

Description

BLF03 is a lead-free solder paste designed for dispensing by manual or automatic dispenser.

The paste is supplied in a 10cc/35g cartridge.

SOLDER CHEMISTRY SC BLF03 solder paste is a high-tech product
suitable for all SMT applications.
SC BLF03 is a homogeneous blend of solder powder, in all required alloys and grain sizes, with an organic flux based on synthetic rosin, conforming to RE L0
according to J-STD-004 (exceeds RMA requirements). It is therefore one of the most advanced "no-clean"
solder pastes.

SC-BLF03 solder paste is characterized by excellent resistance to slumping, does not form beads, has high adhesiveness and high temperature stability.