Professional rework system using infrared radiation for heating. While the lower preheater ensures even and stable heating of the PCB, the upper infrared radiator intensively heats the area with the desired component. The temperature at the soldering point is sensed contactlessly by an IR sensor; in addition, an external thermocouple can be connected directly to the soldered board.
The upper infrared radiator is mounted on an arm with automatic, height-adjustable sliding. The system can be connected via USB to a PC and temperature profiles can be set, monitored and stored via the supplied IR soft. The set temperature, the actual temperature sensed by the IR sensor or the temperature sensed by an external thermocouple directly on the board under the component are displayed.
When the desired component is unsoldered or soldered, the connected fan automatically starts after the process to ensure that the board cools down gradually. The system is supplied complete with an adjustable work frame for mounting the PCB, including support pins and rails to prevent deflection of the board.
An undeniable advantage over hot air systems is the great versatility of these rework systems without the need to replace hot air nozzles. They find their application especially in the repair of motherboards, graphics, X-box, mobile phones, tablets, in the replacement of LCCC, BGA, QFP, PLCC housings, where soldering with the classic contact method is impossible or there is a risk of blowing away miniature components in the vicinity or directly on the chip body.
