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The design of the machine allows soldering even the most complex boards with a maximum format of 500 x 500 x 60 mm while ensuring optimal quality thanks to:
- Inert atmosphere resulting from the liquid (medium) used.
- Negligible temperature difference across the entire component
- Flawless handling during the soldering cycle
New innovations:
- Including a high efficiency heat sink
- Up to 10 temperature levels can be set
- ESD colour (depending on batch - to be confirmed on order)
- ESD top glass
- Real-time profile display
- Lighted signal bar
The main applications concern leaded and lead-free soldering of all types of boards, even the most complex conductive adhesives and reworks.
Today, the concept of vapor brazing allows:
- Reduced liquid consumption (medium) through a unique vapor recovery system; this significantly reduces production costs
- Fast return on investment and high capacity for mixed production
- Optimal soldering quality in an inert atmosphere
- Compensation for tank pressure fluctuations
- Minimum temperature difference throughout the work area - not achievable with other technologies
- Reduced energy consumption
- Rework: Desoldering and re-soldering
- High reliability for all types of soldering
- Accuracy and repeatability
- Large-format boards 500 x 500 x 60 mm can be soldered
Technical specifications:
Max. PCB dimensions 500 x 500 x 60 mm
Max. load capacity 2 Kg
Media capacity: 5 kg
Dimensions (L x D x H) 830 x 775 x 1140 mm
Max. power input 7.5 KW/H
Power supply 3 x 400 V + N / 50 Hz
- Inert atmosphere resulting from the liquid (medium) used.
- Negligible temperature difference across the entire component
- Flawless handling during the soldering cycle
New innovations:
- Including a high efficiency heat sink
- Up to 10 temperature levels can be set
- ESD colour (depending on batch - to be confirmed on order)
- ESD top glass
- Real-time profile display
- Lighted signal bar
The main applications concern leaded and lead-free soldering of all types of boards, even the most complex conductive adhesives and reworks.
Today, the concept of vapor brazing allows:
- Reduced liquid consumption (medium) through a unique vapor recovery system; this significantly reduces production costs
- Fast return on investment and high capacity for mixed production
- Optimal soldering quality in an inert atmosphere
- Compensation for tank pressure fluctuations
- Minimum temperature difference throughout the work area - not achievable with other technologies
- Reduced energy consumption
- Rework: Desoldering and re-soldering
- High reliability for all types of soldering
- Accuracy and repeatability
- Large-format boards 500 x 500 x 60 mm can be soldered
Technical specifications:
Max. PCB dimensions 500 x 500 x 60 mm
Max. load capacity 2 Kg
Media capacity: 5 kg
Dimensions (L x D x H) 830 x 775 x 1140 mm
Max. power input 7.5 KW/H
Power supply 3 x 400 V + N / 50 Hz