• On sale!
SC BLF 04 bezolovnatá pájecí pasta pro tisk Sn96,5Ag3Cu0,5
SC BLF 04 bezolovnatá pájecí pasta pro tisk Sn96,5Ag3Cu0,5

Lead-free solder paste BLF04 Sn96,5Ag3Cu0,5

SC-BLF04
Solder Chemistry
In stock 1 pck
2,200.00 CZK
Tax excluded
2,662.00 CZK Tax included

Product features
Type of material:
Mail
Type of solder:
Unleaded
Alloy composition:
Sn96.5Ag3Cu0.5
Package weight:
0.5 kg
Type of packaging:
The crucible
 
BLF04 is a lead-free solder paste designed for screen printing applications in T4 class.

The paste is supplied in a 0.5 kg cup.

SOLDER CHEMISTRY SC BLF04 solder paste is a high-tech product
suitable for all SMT applications.
SC BLF04 is a homogeneous blend of solder powder, in all required alloys and grain sizes, with an organic flux based on synthetic rosin, conforming to RE L0
according to J-STD-004 or RMA. It is therefore one of the most advanced "no-clean"
solder pastes.

SC-BLF04 solder paste is characterized by excellent crash resistance, long processing time of hours, no bead formation, high tack and high temperature stability.
Product added to wishlist
Product added to compare.