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SC BLF 04 bezolovnatá pájecí pasta pro tisk Sn96,5Ag3Cu0,5
SC BLF 04 bezolovnatá pájecí pasta pro tisk Sn96,5Ag3Cu0,5

Lead-free solder paste BLF04 Sn96,5Ag3Cu0,5

SC-BLF04
Solder Chemistry
In stock 1 pck
2,320.00 CZK
Tax excluded
2,807.20 CZK Tax included

Product features
Type of material:
Mail
Type of solder:
Unleaded
Alloy composition:
Sn96.5Ag3Cu0.5
Package weight:
0.5 kg
Type of packaging:
The crucible
 
BLF04 is a lead-free solder paste designed for screen printing applications in T4 class.

The paste is supplied in a 0.5 kg cup.

SOLDER CHEMISTRY SC BLF04 solder paste is a high-tech product
suitable for all SMT applications.
SC BLF04 is a homogeneous blend of solder powder, in all required alloys and grain sizes, with an organic flux based on synthetic rosin, conforming to RE L0
according to J-STD-004 or RMA. It is therefore one of the most advanced "no-clean"
solder pastes.

SC-BLF04 solder paste is characterized by excellent crash resistance, long processing time of hours, no bead formation, high tack and high temperature stability.
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