SC-BLF03 - Bezolovnatá pájecí pasta Sn96,5Ag3,5
SC-BLF03 - Bezolovnatá pájecí pasta Sn96,5Ag3,5

Lead-free solder paste BLF03 Sn96,5Ag3,5

SC-BLF03
Solder Chemistry
delivery 25-30 days
780.00 CZK
Tax excluded
943.80 CZK Tax included

Product features
Type of material:
Mail
Type of solder:
Unleaded
Alloy composition:
Sn96.5Ag3.5
Package weight:
0.035 kg
Type of packaging:
Cartridge
 
BLF03 is a lead-free solder paste designed for dispensing by manual or automatic dispenser.

The paste is supplied in a 10cc/35g cartridge.

SOLDER CHEMISTRY SC BLF03 solder paste is a high-tech product
suitable for all SMT applications.
SC BLF03 is a homogeneous blend of solder powder, in all required alloys and grain sizes, with an organic flux based on synthetic rosin, conforming to RE L0
according to J-STD-004 (exceeds RMA requirements). It is therefore one of the most advanced "no-clean"
solder pastes.

SC-BLF03 solder paste is characterized by excellent resistance to slumping, does not form beads, has high adhesiveness and high temperature stability.
You might also like

Product added to wishlist
Product added to compare.