Hot air rework system QUICK 856AE

The QUICK 856AE hot air rework system is suitable for soldering and desoldering surface mount components such as SOIC, CHIP, QFP, PLCC, BGA, etc. Thanks to its parameters (high performance, fast temperature rise, perfect temperature stability), this rework system meets the demanding requirements for lead-free soldering.

Precise temperature control and infinitely variable air flow rate from 1 to 90l/min (flow rate adjustment in 1/200 steps) allow soldering without thermal damage to the components and with minimal impact on surrounding components. The temperature profile can be set in four phases when components are soldered, where temperature, time and air flow can be set in each phase. All of these values are displayed on a clear LCD display.

The hot air handle is equipped with a magnetic switch that allows automatic aftercooling to 100°C when the handle is placed in the stand, only after the aftercooling the compressor is switched off. When the handle is removed from the stand, the station starts automatically. This design greatly facilitates work and protects the heating element from unnecessary thermal stress. The magnetic switch function can be replaced by a foot pedal. For example, if the handle is clamped in the QUICK800 holder, pressing the foot pedal will start the hot air, pressing it again will start the process of cooling the heating element.

The operation of the station is very intuitive. The hot air handle is light and easy to operate. Sufficient airflow is ensured by the Vortex compressor with brushless motor whose noise level does not exceed 60dB. NK1124-Single 2,5, NK1130-Single 4,4, NK2064-Single 6,4. Other types of hot air nozzles for different SMD component housings can be found by clicking the banner below.