Repair gel flux MOB39 - cup 150g

Economical packaging of MOB39 gel flux for direct application or for refilling into dispensing cartridges.

MOB39 gel flux has been specially developed in MBO laboratories for surface mount technology (SMT).

MOB39 gel flux is primarily intended for microelectronic circuits using BGA components, but its viscosity makes it an ideal flux for other applications:

a) As an alternative to solder paste where there is already a sufficient amount of solder alloy on the surface.
b) For repair/rework where the component already carries solder alloy on its solder pad.

MOB39 gel flux has a high purity rosin base with equivalent RMA activation (Rosin Mildly
Active) to remove oxidants from the surface of the solder pad. The finished solder joint will be the same as when using a screen-applied solder paste.


MOB39 is designed for "no-clean" technology. After soldering, a very low level of residue remains, which
can be left without risk of corrosion.