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HR-30 large reflow oven with N2 support and extraction
HR-30
Elpro
Product features
400 V
Yes
600 x 410 mm
Drawer
7800 W
IR + convention
896 x 545 x 420 mm
Up to 260 °C
Average 560 lt/hr
Large re-melting furnace for PCB up to 600 mm length. The new largest reflow oven for SMT production of prototypes and small PCB series. All in one: installation of N2 atmosphere, profile measurement on PCB with 4 thermocouples, extraction of chamber fumes from the door.
HR-30 is a new generation drawer reflow oven designed preferably for lead-free soldering. The chamber houses 10 halogen emitters for rapid temperature rise. Two heating coils together with internal fans guarantee even temperature distribution even in areas of so-called heat shadows. The relatively small temperature difference between the components thus achieved is perfectly suited for lead-free soldering.
The advantage of the plug-in single chamber reflow oven is the possibility of setting a special temperature profile for each board, while the maximum soldering time is practically unlimited. The HR-30 allows 3 types of programs to be entered
- saddle - sets the preheat and reflow times and temperatures
- linear - sets the temperature rise separately in each of the 5 segments
- drying - maintains the set temperature for up to 16 hours
In addition to these data, nitrogen use (valve open and close time), door extension length, cooling fan speed after reflow is complete and door opening are also set. The data is entered either directly via the furnace's touch screen or using a Windows program from a connected PC. In addition to entering program parameters, the HR-WIN software also archives programs from the furnace, records and displays measured temperature profiles
The HR-30 furnace is designed as a stand-alone device. The solder plate is placed on the grid in the door and at the push of a button the door closes itself and the soldering process takes place. After the soldering process is completed, the board on the grate is slid out, where forced cooling of both the PCB and the inside of the chamber takes place.
For accurate monitoring and temperature recording from up to 8 channels, we recommend using the Datalogger MTP-05.
Technical data:
Max. PCB size: 600 x 410 mm
Max. 200 °C
Preheating time: 10-600 s
Max. reflow temperature: 260 °C
Preheating time: 1-300 s
Max. drying temperature: 150 °C
Drying time: 1-999 minutes = 16 hours
Number of programs: 99, reflow (saddle/linear) or drying
Max.
Power supply: three-phase, 3 x 400 V, 50 Hz
Power input : max 7800 W, average 3500 W
Cooling: 4 fans under the grate, 4 x 720 lt/min (adjustable)
Extraction 1 + 2: 1. From the door during the program run, 2. From inside the chamber 1500 l/min after the end of remelting
N2 consumption: average 560 lt/hr, maximum 1200 lt/hr
N2 pressure: 2-6 bar
PC connection: USB 2.0
Dimensions dxwxv: 896 x 545 x 420 mm
Weight max: 47 kg
HR-30 is a new generation drawer reflow oven designed preferably for lead-free soldering. The chamber houses 10 halogen emitters for rapid temperature rise. Two heating coils together with internal fans guarantee even temperature distribution even in areas of so-called heat shadows. The relatively small temperature difference between the components thus achieved is perfectly suited for lead-free soldering.
The advantage of the plug-in single chamber reflow oven is the possibility of setting a special temperature profile for each board, while the maximum soldering time is practically unlimited. The HR-30 allows 3 types of programs to be entered
- saddle - sets the preheat and reflow times and temperatures
- linear - sets the temperature rise separately in each of the 5 segments
- drying - maintains the set temperature for up to 16 hours
In addition to these data, nitrogen use (valve open and close time), door extension length, cooling fan speed after reflow is complete and door opening are also set. The data is entered either directly via the furnace's touch screen or using a Windows program from a connected PC. In addition to entering program parameters, the HR-WIN software also archives programs from the furnace, records and displays measured temperature profiles
The HR-30 furnace is designed as a stand-alone device. The solder plate is placed on the grid in the door and at the push of a button the door closes itself and the soldering process takes place. After the soldering process is completed, the board on the grate is slid out, where forced cooling of both the PCB and the inside of the chamber takes place.
For accurate monitoring and temperature recording from up to 8 channels, we recommend using the Datalogger MTP-05.
Technical data:
Max. PCB size: 600 x 410 mm
Max. 200 °C
Preheating time: 10-600 s
Max. reflow temperature: 260 °C
Preheating time: 1-300 s
Max. drying temperature: 150 °C
Drying time: 1-999 minutes = 16 hours
Number of programs: 99, reflow (saddle/linear) or drying
Max.
Power supply: three-phase, 3 x 400 V, 50 Hz
Power input : max 7800 W, average 3500 W
Cooling: 4 fans under the grate, 4 x 720 lt/min (adjustable)
Extraction 1 + 2: 1. From the door during the program run, 2. From inside the chamber 1500 l/min after the end of remelting
N2 consumption: average 560 lt/hr, maximum 1200 lt/hr
N2 pressure: 2-6 bar
PC connection: USB 2.0
Dimensions dxwxv: 896 x 545 x 420 mm
Weight max: 47 kg
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